微真空器件实验室

欢迎来到微真空实验室!

我们长期致力于将微纳加工技术应用到真空电子器件上，实现片上微型真空电子器件。传统的真空电子器件一般是基于热阴极的玻璃管/金属管形态，体积大、成本高、难集成，采用微纳加工技术可以实现更小的器件尺寸、更低的成本和阵列集成。本实验室专注研究片上微型电子源技术和片上真空封装技术，力图实现各类真空电子器件的片上化和晶圆级加工，从而在安全、医疗、科研、工业等领域进行广泛地应用。

近期发表

Wafer-Level Micromachined All-Glass Atomic Vapor Cells

Zhenyu Hu, Qiaohui Yang, Taoyuan Zhu, Duo Pan, Zhiwei Li, Jingbiao Chen, Xianlong Wei. IEEE Electron Device Letters

Wafer-scale fabricated Y2O3-Ir thermionic electron sources for robust operation in rough vacuum

Weidong Rao, Yinuo Ma, Yazhe Yan, Yuqiang Yu, Ye Zhao, Ruixue Ding, Yang Li, Yixuan Bao, Zhiwei Li,Xianlong Wei. IEEE Electron Device Letters

Electrical breakdown characteristics of microscale tubular air gaps with increased breakdown voltage

Kechang Zhang, Yidan He, Zhiwei Li and Xianlong Wei . Journal of Physics D: Applied Physics

Dielectric strength weakening of hexagonal boron nitride nanosheets under mechanical stress

Bingjie Wang, Chuanli Yu, Yifan Jiang, Chong Tian, Jiamin Tian, Shuo Li, Zheng Fang, Menglan Li, Weilong Wu, Zhaohe Dai, Takashi Taniguchi, Kenji Watanabe, Qing Chen & Xianlong Wei. Nature Communications

欢迎来到微真空实验室!

近期发表

Wafer-Level Micromachined All-Glass Atomic Vapor Cells

Wafer-scale fabricated Y2O3-Ir thermionic electron sources for robust operation in rough vacuum

Electrical breakdown characteristics of microscale tubular air gaps with increased breakdown voltage

Dielectric strength weakening of hexagonal boron nitride nanosheets under mechanical stress

近期新闻

第二十三届中国电子学会真空电子学分会学术年会

参加第39届国际真空纳米电子会议

晶圆级微加工全玻璃原子气室

粗真空耐受性强的片上微型热发射电子源

具有更高击穿电压的微尺度管状空气间隙的电气击穿特性