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我们长期致力于将微纳加工技术应用到真空电子器件上，实现片上微型真空电子器件。传统的真空电子器件一般是基于热阴极的玻璃管/金属管形态，体积大、成本高、难集成，采用微纳加工技术可以实现更小的器件尺寸、更低的成本和阵列集成。本实验室专注研究片上微型电子源技术和片上真空封装技术，力图实现各类真空电子器件的片上化和晶圆级加工，从而在安全、医疗、科研、工业等领域进行广泛地应用。

近期发表

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Wafer-Scale Fabricated MEMS-type Ionization Vacuum Sensors Based on Through Glass Via Technology
Yanqing Zhao, Yuqiang Yu, Yidan He, Yang Li, Dengzhu Guo, Zhiwei Li, Xianlong Wei. IEEE Transactions on Electron Devices
An on-chip vacuum triode based on thermionic electron emission from super-aligned carbon nanotube films
Yidan He, Jun Yao, Yanqing Zhao, Peng Liu, Zhiwei Li, Xianlong Wei. Journal of Materials Chemistry C
Wafer-scale fabricated on-chip thermionic electron sources based on a suspended Y2O3/TiN filament
Weidong Rao, Zhiwei Li, Dengzhu Guo, Yang Li, Taoyuan Zhu, Xianlong Wei. IEEE Electron Device Letters
A Vacuum Transistor Based on Electron Emission From SiOₓ Tunneling Diodes
Yidan He, Hanyang Zang, Jun Yao, Zhiwei Li, Gengmin Zhang, Xianlong Wei. IEEE Transactions on Electron Devices

近期新闻

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