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我们长期致力于将微纳加工技术应用到真空电子器件上，实现片上微型真空电子器件。传统的真空电子器件一般是基于热阴极的玻璃管/金属管形态，体积大、成本高、难集成，采用微纳加工技术可以实现更小的器件尺寸、更低的成本和阵列集成。本实验室专注研究片上微型电子源技术和片上真空封装技术，力图实现各类真空电子器件的片上化和晶圆级加工，从而在安全、医疗、科研、工业等领域进行广泛地应用。

近期发表

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Wafer-Level Micromachined All-Glass Atomic Vapor Cells
Zhenyu Hu, Qiaohui Yang, Taoyuan Zhu, Duo Pan, Zhiwei Li, Jingbiao Chen, Xianlong Wei. IEEE Electron Device Letters
Wafer-scale fabricated Y2O3-Ir thermionic electron sources for robust operation in rough vacuum
Weidong Rao, Yinuo Ma, Yazhe Yan, Yuqiang Yu, Ye Zhao, Ruixue Ding, Yang Li, Yixuan Bao, Zhiwei Li,Xianlong Wei. IEEE Electron Device Letters
Electrical breakdown characteristics of microscale tubular air gaps with increased breakdown voltage
Kechang Zhang, Yidan He, Zhiwei Li and Xianlong Wei . IEEE Electron Device Letters
Dielectric strength weakening of hexagonal boron nitride nanosheets under mechanical stress
Bingjie Wang, Chuanli Yu, Yifan Jiang, Chong Tian, Jiamin Tian, Shuo Li, Zheng Fang, Menglan Li, Weilong Wu, Zhaohe Dai, Takashi Taniguchi, Kenji Watanabe, Qing Chen & Xianlong Wei. Nature Communications

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