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我们长期致力于将微纳加工技术应用到真空电子器件上，实现片上微型真空电子器件。传统的真空电子器件一般是基于热阴极的玻璃管/金属管形态，体积大、成本高、难集成，采用微纳加工技术可以实现更小的器件尺寸、更低的成本和阵列集成。本实验室专注研究片上微型电子源技术和片上真空封装技术，力图实现各类真空电子器件的片上化和晶圆级加工，从而在安全、医疗、科研、工业等领域进行广泛地应用。

近期发表

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Dielectric strength weakening of hexagonal boron nitride nanosheets under mechanical stress
Bingjie Wang, Chuanli Yu, Yifan Jiang, Chong Tian, Jiamin Tian, Shuo Li, Zheng Fang, Menglan Li, Weilong Wu, Zhaohe Dai, Takashi Taniguchi, Kenji Watanabe, Qing Chen & Xianlong Wei. Nature Communications
Compact optical frequency standard using a wafer-level MEMS vapor cell
Qiaohui Yang, Zhenyu Hu, Tianyu Liu, Jie Miao, Pengyuan Chang, Duo Pan, Zhiwei Li, Xianlong Wei, and Jingbiao Chen. Photonics Research
Thermionic Electron Sources Based on Microscale Tungsten Filaments on a Glass Wafer
Weidong Rao, Yuqiang Yu, Yang Li, Dengzhu Guo, Zhiwei Li, Xianlong Wei. IEEE Transactions on Electron Devices
Enhancing Velocity and Energy Efficiency of Ionic Wind by Joule-Heating the Discharge Electrode
Shuyu Mao; Zhiwei Li; Dengzhu Guo; Weidong Rao; Xianlong Wei. IEEE Transactions on Plasma Science

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