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我们长期致力于将微纳加工技术应用到真空电子器件上，实现片上微型真空电子器件。传统的真空电子器件一般是基于热阴极的玻璃管/金属管形态，体积大、成本高、难集成，采用微纳加工技术可以实现更小的器件尺寸、更低的成本和阵列集成。本实验室专注研究片上微型电子源技术和片上真空封装技术，力图实现各类真空电子器件的片上化和晶圆级加工，从而在安全、医疗、科研、工业等领域进行广泛地应用。

近期发表

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A Vacuum Transistor Based on Electron Emission From SiOₓ Tunneling Diodes
Yidan He, Hanyang Zang, Jun Yao, Zhiwei Li, Gengmin Zhang, Xianlong Wei. IEEE Transactions on Electron Devices
A MEMS-Type Ionization Vacuum Sensor With a Wide Measurement Range
Yanqing Zhao, Zhiwei Li, Yidan He, Shuyu Mao, Dengzhu Guo, Xianlong Wei. IEEE Electron Device Letters
Micro-Pirani Pressure Sensor With Operation Range Beyond Atmospheric Pressure Based on Aligned Carbon Nanotube Films
Yuwei Wang, Chenxi Liu, Jun Qiu, Yidan He, Zhiwei Li, Peng Liu, Xianlong Wei. IEEE Electron Device Letters
Large and Pressure-Dependent c-Axis Piezoresistivity of Highly Oriented Pyrolytic Graphite near Zero Pressure
Bingjie Wang, Juyao Li, Zheng Fang, Yifan Jiang, Shuo Li, Fangyuan Zhan, Zhaohe Dai, Qing Chen, Xianlong Wei. Nano Letters

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