Group News

• Dielectric strength weakening of hexagonal boron nitride nanosheets under mechanical stress

    August 29, 2025  We has achieved the demonstration of dielectric-strength weakening in hexagonal boron-nitride nanosheets under mechanical stress.

• Compact optical frequency standard using a wafer-level MEMS vapor cell

    August 1, 2025  We contributed to the development of a compact optical frequency standard using a wafer-level MEMS vapor cell.

• Congratulations to doctoral students Yidan He and Yanqing Zhao on graduating successfully

    July 1, 2025  Doctoral students Yidan He and Yanqing Zhao have graduated successfully and obtained a Doctor of Science degree.

• Thermionic Electron Sources Based on Microscale Tungsten Filaments on a Glass Wafer

    June 8, 2025  We report a Thermionic Electron Sources based on microscale tungsten filaments on a glass wafer.

• Enhancing the wind velocity and energy efficiency of ionic wind by Joule-Heating the discharge electrode

    May 11, 2025  We developed a method to enhance both ionic wind velocity and energy efficiency by employing Joule heating of the discharge electrode.

• Wafer-Scale Fabricated MEMS-type Ionization Vacuum Sensors Based on Through Glass Via Technology

    December 16, 2024  We report a MEMS ionization vacuum sensor with 4-inch wafer-level fabrication.

• Mechanical and electromechanical properties of 2D materials studied via in situ microscopy techniques

    December 3, 2024  We has comprehensively reviewed the mechanical and mechanoelectrical properties of two-dimensional materials investigated via in-situ microscopy techniques.

• An on-chip vacuum triode based on thermionic electron emission from super-aligned carbon nanotube films

    September 19, 2024  An on-chip vacuum triode based on thermionic electron emission from suspended super-aligned carbon nanotube films is realized by microfabrication technology.

• Wafer-scale fabricated on-chip thermionic electron sources based on a suspended $\mathrm{Y_2O_3}$/$\mathrm{TiN}$ filament

    September 18, 2024  We report a new on-chip electron source based on thermionic electron emission from a suspended $\mathrm{Y_2O_3}$/$\mathrm{TiN}$ filament.

• Participated in the 27th International Vacuum Nanoelectronics Conference (IVNC)

    July 20, 2024  Professor Wei led his research team to participate in the 37th International Vacuum Nanoelectronics Conference in the Czech Republic from July 15th to 19th, 2024.